Købe B59753B120A70 med BYCHPS
Køb med garanti
B59753B120A70
- Varenummer:
- B59753B120A70
- Fabrikant:
- EPCOS
- Beskrivelse:
- PTC RESETTABLE 56MA 380V RAD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17301 Pieces
- Datablad:
- B59753B120A70.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for B59753B120A70, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til B59753B120A70 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Maks: | 420V |
|---|---|
| Type: | Ceramic |
| Tid til tur: | 3s |
| Tykkelse (Max): | - |
| Størrelse / Dimension: | 0.492" Dia x 0.276" W (12.50mm x 7.00mm) |
| Serie: | - |
| Modstand - Post Trip (R1) (Max): | - |
| Modstand - Initial (Ri) (Min): | - |
| Modstand - 25 ° C (Typ): | 120 Ohm |
| Vurderinger: | - |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Disc |
| Andre navne: | 495-3882 B59753B 120A 70 B59753B0120A070 B59753B0120A070-ND B59753B120A70-ND |
| Driftstemperatur: | 0°C ~ 60°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | B59753B120A70 |
| Blyafstand: | 0.197" (5.00mm) |
| Højde - Siddende (Max): | 0.650" (16.50mm) |
| Udvidet beskrivelse: | PTC Resettable Fuse 420V Ih Through Hole Radial, Disc |
| Beskrivelse: | PTC RESETTABLE 56MA 380V RAD |
| Nuværende - tur (it): | 112mA |
| Nuværende - Maks: | 2A |
| Godkendelser: | UL |
| Email: | [email protected] |
Relaterede dele til B59753B120A70
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers