Købe B82732R2771B30 med BYCHPS
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B82732R2771B30
- Varenummer:
- B82732R2771B30
- Fabrikant:
- EPCOS
- Beskrivelse:
- D CORE DBL CHOKE 39MH 0.77A VER
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19332 Pieces
- Datablad:
- B82732R2771B30.pdf
Introduktion
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specifikationer
| Serie: | B82732 |
|---|---|
| Andre navne: | B82732R2771B 30 B82732R2771B030 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | B82732R2771B30 |
| Udvidet beskrivelse: | Line Common Mode Choke DCR |
| Beskrivelse: | D CORE DBL CHOKE 39MH 0.77A VER |
| Email: | [email protected] |
Relaterede dele til B82732R2771B30
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
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B82732W2142B30 | EPCOS (TDK) | CMC 10MH 1.4A 2LN TH | Forespørgsel |
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B82732R2401B30 | EPCOS (TDK) | CMC 100MH 400MA 2LN TH | Forespørgsel |
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B82732R2901B30 | EPCOS (TDK) | CMC 27MH 900MA 2LN TH | Forespørgsel |
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B82732R2112B30 | EPCOS (TDK) | CMC 15MH 1.1A 2LN TH | Forespørgsel |
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B82732F2601B1 | EPCOS (TDK) | CMC 68MH 600MA 2LN TH | Forespørgsel |
|
B82732R2142B30 | EPCOS (TDK) | CMC 10MH 1.4A 2LN TH | Forespørgsel |
|
B82732R2701B30 | EPCOS (TDK) | CMC 39MH 700MA 2LN TH | Forespørgsel |
|
B82732R2172B30 | EPCOS (TDK) | CMC 6.8MH 1.7A 2LN TH | Forespørgsel |
|
B82732R2601B30 | EPCOS (TDK) | CMC 47MH 600MA 2LN TH | Forespørgsel |
|
B82732R2222B30 | EPCOS (TDK) | CMC 3.3MH 2.2A 2LN TH | Forespørgsel |
|
B82732R2102B30 | EPCOS (TDK) | COMMON MODE CHOKE 22MH 1A 2LN TH | Forespørgsel |
|
B82732W2222B30 | EPCOS (TDK) | CMC 3.3MH 2.2A 2LN TH | Forespørgsel |
|
B82732R2501B30 | EPCOS (TDK) | D CORE DBL CHOKE 30MH 0.5A VERT | Forespørgsel |
|
B82732F2451B1 | EPCOS (TDK) | CMC 100MH 450MA 2LN TH | Forespørgsel |
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B82732W2112B30 | EPCOS (TDK) | CMC 15MH 1.1A 2LN TH | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers