Købe BAS40DW-05-TP med BYCHPS
Køb med garanti
BAS40DW-05-TP
- Varenummer:
- BAS40DW-05-TP
- Fabrikant:
- Micro Commercial Components (MCC)
- Beskrivelse:
- DIODE ARRAY SCHOTTKY 40V SOT363
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17089 Pieces
- Datablad:
- BAS40DW-05-TP.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BAS40DW-05-TP, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BAS40DW-05-TP via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Videresend (Vf) (Max) @ Hvis: | 1V @ 40mA |
|---|---|
| Spænding - DC-omvendt (Vr) (Max): | 40V |
| Leverandør Device Package: | SOT-363 |
| Fart: | Small Signal =< 200mA (Io), Any Speed |
| Serie: | - |
| Reverse Recovery Time (trr): | 5ns |
| Emballage: | Original-Reel® |
| Pakke / tilfælde: | 6-TSSOP, SC-88, SOT-363 |
| Andre navne: | BAS40DW-05-TPDKR |
| Driftstemperatur - Junction: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | BAS40DW-05-TP |
| Udvidet beskrivelse: | Diode Array 2 Pair Common Cathode Schottky 40V 200mA Surface Mount 6-TSSOP, SC-88, SOT-363 |
| Diodetype: | Schottky |
| Diode Konfiguration: | 2 Pair Common Cathode |
| Beskrivelse: | DIODE ARRAY SCHOTTKY 40V SOT363 |
| Nuværende - Reverse Lækage @ Vr: | 200nA @ 30V |
| Nuværende - Gennemsnitlig Rectified (Io) (pr. Diode): | 200mA |
| Email: | [email protected] |
Relaterede dele til BAS40DW-05-TP
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers