Købe BAT 18-04 E6327 med BYCHPS
Køb med garanti
BAT 18-04 E6327
- Varenummer:
- BAT 18-04 E6327
- Beskrivelse:
- DIODE ARRAY GP 35V 100MA SOT23
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14432 Pieces
- Datablad:
- BAT 18-04 E6327.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BAT 18-04 E6327, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BAT 18-04 E6327 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Videresend (Vf) (Max) @ Hvis: | 1.2V @ 100mA |
|---|---|
| Spænding - DC-omvendt (Vr) (Max): | 35V |
| Leverandør Device Package: | PG-SOT23-3 |
| Fart: | Small Signal =< 200mA (Io), Any Speed |
| Serie: | - |
| Reverse Recovery Time (trr): | 120ns |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-236-3, SC-59, SOT-23-3 |
| Andre navne: | BAT 18-04 E6327-ND BAT1804E6327BTSA1 BAT1804E6327HTSA1 BAT1804E6327XT BAT5402VH6327XTSA1 SP000010290 |
| Driftstemperatur - Junction: | 150°C (Max) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | BAT 18-04 E6327 |
| Udvidet beskrivelse: | Diode Array 1 Pair Series Connection Standard 35V 100mA (DC) Surface Mount TO-236-3, SC-59, SOT-23-3 |
| Diodetype: | Standard |
| Diode Konfiguration: | 1 Pair Series Connection |
| Beskrivelse: | DIODE ARRAY GP 35V 100MA SOT23 |
| Nuværende - Reverse Lækage @ Vr: | 20nA @ 20V |
| Nuværende - Gennemsnitlig Rectified (Io) (pr. Diode): | 100mA (DC) |
| Email: | [email protected] |
Relaterede dele til BAT 18-04 E6327
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers