Købe BB804SF1E6327HTSA1 med BYCHPS
Køb med garanti
BB804SF1E6327HTSA1
- Varenummer:
- BB804SF1E6327HTSA1
- Beskrivelse:
- DIODE VAR CAP 18V 50MA SOT-23
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 18489 Pieces
- Datablad:
- BB804SF1E6327HTSA1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BB804SF1E6327HTSA1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BB804SF1E6327HTSA1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Peak Reverse (Max): | 18V |
|---|---|
| Leverandør Device Package: | PG-SOT23-3 |
| Serie: | - |
| Q @ Vr, F: | 200 @ 2V, 100 MHz |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-236-3, SC-59, SOT-23-3 |
| Andre navne: | BB 804 SF1 E6327 BB 804 SF1 E6327-ND BB804SF1E6327BTSA1 BB804SF1E6327XT SP000010425 |
| Driftstemperatur: | -55°C ~ 125°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | BB804SF1E6327HTSA1 |
| Udvidet beskrivelse: | Varactor 1 Pair Common Cathode 18V Surface Mount PG-SOT23-3 |
| Diodetype: | 1 Pair Common Cathode |
| Beskrivelse: | DIODE VAR CAP 18V 50MA SOT-23 |
| Kapacitansforholdstilstand: | C2/C8 |
| Kapacitansforhold: | 1.71 |
| Kapacitans @ Vr, F: | 47.5pF @ 2V, 1MHz |
| Email: | [email protected] |
Relaterede dele til BB804SF1E6327HTSA1
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
ZMV835ATC | Diodes Incorporated | DIODE VARACTOR 25V SOD323 | Forespørgsel |
 |
BB814E6327GR2HTSA1 | Infineon Technologies | DIODE VAR CAP 18V 50MA SOT-23 | Forespørgsel |
 |
BBY5305WE6327HTSA1 | Infineon Technologies | DIODE TUNING HIGH Q CC SOT-323 | Forespørgsel |
|
BB804SF2E6327HTSA1 | Infineon Technologies | DIODE VAR CAP 18V 50MA SOT-23 | Forespørgsel |
 |
SVC383T-TL-E | ON Semiconductor | DIODE VARACTOR 33V CPH3 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers