Købe BD6550G-TR med BYCHPS
Køb med garanti
BD6550G-TR
- Varenummer:
- BD6550G-TR
- Fabrikant:
- LAPIS Semiconductor
- Beskrivelse:
- IC POWER MANAGEMENT 2A SSOP6
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15571 Pieces
- Datablad:
- BD6550G-TR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BD6550G-TR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BD6550G-TR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning (Max): | 12V |
|---|---|
| Leverandør Device Package: | 6-SSOP |
| Serie: | - |
| Programmerbare funktioner: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | SOT-23-6 |
| Driftstemperatur: | 0°C ~ 85°C (TA) |
| Antal celler: | - |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | BD6550G-TR |
| grænseflade: | - |
| Fejlbeskyttelse: | - |
| Udvidet beskrivelse: | Charger IC 6-SSOP |
| Beskrivelse: | IC POWER MANAGEMENT 2A SSOP6 |
| Nuværende - Opladning: | Constant |
| Ladestrøm - Maks: | 50mA |
| Batteripakke Spænding: | - |
| Batterikemi: | - |
| Email: | [email protected] |
Relaterede dele til BD6550G-TR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
BQ24150AYFFT | Texas Instruments | IC LI-ION CHARGE MGMT 20DSBGA | Forespørgsel |
 |
ISL78692-1CR3Z-T | Intersil | IC BATT CHARGER LI-ION 10DFN | Forespørgsel |
|
ISL9301IRZ-T | Intersil | IC CHRGR LI-ION HV SGL 10-TDFN | Forespørgsel |
 |
LT1512IS8#PBF | Linear Technology | IC BATT CHRGR CONST I/V 8-SOIC | Forespørgsel |
 |
ISL6292-1CR5-T | Intersil | IC BATT CHRGR LI-ION 4.1V 16-QFN | Forespørgsel |
 |
BD6551G-TR | Rohm Semiconductor | IC BATTERY CONTROLLER 6-SSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers