Købe BD9251FV-E2 med BYCHPS
Køb med garanti
BD9251FV-E2
- Varenummer:
- BD9251FV-E2
- Fabrikant:
- LAPIS Semiconductor
- Beskrivelse:
- IC PREAMP HBD PIR SENSOR 14-SSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17358 Pieces
- Datablad:
- BD9251FV-E2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BD9251FV-E2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BD9251FV-E2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Preamplifier |
|---|---|
| Leverandør Device Package: | 14-SSOP |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 14-LSSOP (0.173", 4.40mm Width) |
| Output Type: | Voltage |
| Andre navne: | BD9251FV-E2TR BD9251FVE2 |
| Driftstemperatur: | -30°C ~ 75°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 10 Weeks |
| Producentens varenummer: | BD9251FV-E2 |
| grænseflade: | - |
| Input Type: | Voltage |
| Beskrivelse: | IC PREAMP HBD PIR SENSOR 14-SSOP |
| Nuværende - Forsyning: | 300µA |
| Email: | [email protected] |
Relaterede dele til BD9251FV-E2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
TDC-GP30YD | ams | IC CONVERTER SPI UART 32QFN | Forespørgsel |
 |
XTR114U/2K5 | Texas Instruments | IC 4-20MA I-TRANSMITTER 14-SOIC | Forespørgsel |
 |
LX7730-ES | Microsemi Corporation | IC TELE CONTR 64 CHAN 132CQFP | Forespørgsel |
 |
BD9251FV-GE2 | Rohm Semiconductor | IC PREAMP HBD PIR SENSOR 14SSOP | Forespørgsel |
 |
MAX6674ISA+T | Maxim Integrated | IC THERMOCOUP TO DGTL 8-SOIC | Forespørgsel |
 |
AD8497CRMZ | Analog Devices Inc. | IC THERMOCOUPLE A W/COMP 8MSOP | Forespørgsel |
 |
MAX7370ETG+T | Maxim Integrated | IC CTRLR KEY-SW I2C 24TQFN | Forespørgsel |
|
AD598JRZ | Analog Devices Inc. | IC LVDT SGNL COND OSC/REF 20SOIC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers