Købe BF2930 med BYCHPS
Køb med garanti
BF2930
- Varenummer:
- BF2930
- Fabrikant:
- API Delevan
- Beskrivelse:
- FERRITE CORE 257 OHM HINGED 13MM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13029 Pieces
- Datablad:
- BF2930.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BF2930, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BF2930 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Round |
|---|---|
| Serie: | BF |
| Vurderinger: | - |
| Ydermål: | 1.160" W x 1.200" H (29.60mm x 30.50mm) |
| Andre navne: | BF2930 BULK 500 DN4716 |
| Monteringstype: | Free Hanging |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale: | API-1 |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | BF2930 |
| Længde: | 1.300" (33.00mm) |
| Indvendig Dimension: | 0.512" Dia (13.00mm) |
| Impedans @ Frekvens: | 257 Ohm @ 100MHz |
| Udvidet beskrivelse: | Hinged (Snap On) Free Hanging Ferrite Core 257 Ohm @ 100MHz ID 0.512" Dia (13.00mm) OD 1.160" W x 1.200" H (29.60mm x 30.50mm) Length 1.300" (33.00mm) |
| Design: | Hinged (Snap On) |
| Beskrivelse: | FERRITE CORE 257 OHM HINGED 13MM |
| Email: | [email protected] |
Relaterede dele til BF2930
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
28B1142-000 | Laird-Signal Integrity Products | FERRITE CORE 85 OHM SOLID 19MM | Forespørgsel |
 |
CF1-17.5*9.5*28.5 | API Delevan Inc. | FERRITE CORE 217 OHM SOLID 9.5MM | Forespørgsel |
|
CF1-36*23*15 | API Delevan Inc. | FERRITE CORE 113 OHM SOLID 23MM | Forespørgsel |
 |
ESD-R-12E | KEMET | FERRITE CORE SOLID 7.3MM | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers