Købe BFC2 370 35563 med BYCHPS
Køb med garanti
BFC2 370 35563
- Varenummer:
- BFC2 370 35563
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- CAP FILM 0.056UF 10% 250VDC RAD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12748 Pieces
- Datablad:
- BFC2 370 35563.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BFC2 370 35563, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BFC2 370 35563 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | 250V |
|---|---|
| Spændingsbedømmelse - AC: | 160V |
| Tolerance: | ±10% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 0.283" L x 0.177" W (7.20mm x 4.50mm) |
| Serie: | MKT370 |
| Emballage: | Tape & Box (TB) |
| Pakke / tilfælde: | Radial |
| Andre navne: | 2222 370 35563 222237035563 BFC2 370 35563 BFC237035563 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | BFC2 370 35563 |
| Blyafstand: | 0.200" (5.08mm) |
| Højde - Siddende (Max): | 0.354" (9.00mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 0.056µF ±10% Film Capacitor 160V 250V Polyester, Metallized Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polyester, Metallized |
| Beskrivelse: | CAP FILM 0.056UF 10% 250VDC RAD |
| kapacitans: | 0.056µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til BFC2 370 35563
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers