Købe BFC2370EE563 med BYCHPS
Køb med garanti
BFC2370EE563
- Varenummer:
- BFC2370EE563
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- CAP FILM 0.056UF 10% 250VDC RAD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17496 Pieces
- Datablad:
- BFC2370EE563.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BFC2370EE563, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BFC2370EE563 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | 250V |
|---|---|
| Spændingsbedømmelse - AC: | 63V |
| Tolerance: | ±10% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 0.283" L x 0.138" W (7.20mm x 3.50mm) |
| Serie: | MKT370 |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial |
| Andre navne: | 2222370EE563 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | BFC2370EE563 |
| Blyafstand: | 0.200" (5.08mm) |
| Højde - Siddende (Max): | 0.315" (8.00mm) |
| Funktioner: | Long Life |
| Udvidet beskrivelse: | 0.056µF ±10% Film Capacitor 63V 250V Polyester, Metallized Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polyester, Metallized |
| Beskrivelse: | CAP FILM 0.056UF 10% 250VDC RAD |
| kapacitans: | 0.056µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til BFC2370EE563
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog