Købe BFC238352362 med BYCHPS
Køb med garanti
BFC238352362
- Varenummer:
- BFC238352362
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- CAP FILM 3600PF 5% 1.6KVDC RAD
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15140 Pieces
- Datablad:
- BFC238352362.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BFC238352362, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BFC238352362 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | 1600V (1.6kV) |
|---|---|
| Spændingsbedømmelse - AC: | 550V |
| Tolerance: | ±5% |
| Afslutning: | PC Pins |
| Størrelse / Dimension: | 0.689" L x 0.197" W (17.50mm x 5.00mm) |
| Serie: | 383 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | Radial |
| Andre navne: | 2222 383 52362 222238352362 BFC2 383 52362 BFC2 383 52362 |
| Driftstemperatur: | -55°C ~ 105°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | BFC238352362 |
| Blyafstand: | 0.591" (15.00mm) |
| Højde - Siddende (Max): | 0.433" (11.00mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 3600pF ±5% Film Capacitor 550V 1600V (1.6kV) Polypropylene (PP), Metallized Radial |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polypropylene (PP), Metallized |
| Beskrivelse: | CAP FILM 3600PF 5% 1.6KVDC RAD |
| kapacitans: | 3600pF |
| Applikationer: | High Pulse, DV/DT |
| Email: | [email protected] |
Relaterede dele til BFC238352362
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers