Købe BFC280905002 med BYCHPS
Køb med garanti
BFC280905002
- Varenummer:
- BFC280905002
- Fabrikant:
- Angstrohm / Vishay
- Beskrivelse:
- CAP TRIM 1.8-10PF 300V THRU HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12918 Pieces
- Datablad:
- BFC280905002.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BFC280905002, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BFC280905002 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 300V |
|---|---|
| Størrelse / Dimension: | Rectangular - 0.291" L x 0.264" W (7.40mm x 6.70mm) |
| Serie: | BFC2 809 |
| Emballage: | Bulk |
| Andre navne: | 222280905002 |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 25 Weeks |
| Producentens varenummer: | BFC280905002 |
| Højde - Siddende (Max): | 0.354" (9.00mm) |
| Funktioner: | General Purpose |
| Udvidet beskrivelse: | 1.8 ~ 10pF Trimmer Capacitor 300V Top and Bottom Adjustment Through Hole |
| Beskrivelse: | CAP TRIM 1.8-10PF 300V THRU HOLE |
| Kapacitansområde: | 1.8 ~ 10pF |
| Justeringstype: | Top and Bottom Adjustment |
| Email: | [email protected] |
Relaterede dele til BFC280905002
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers