Købe BFN26E6327HTSA1 med BYCHPS
Køb med garanti
BFN26E6327HTSA1
- Varenummer:
- BFN26E6327HTSA1
- Beskrivelse:
- TRANS NPN 300V 0.2A SOT-23
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15389 Pieces
- Datablad:
- BFN26E6327HTSA1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BFN26E6327HTSA1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BFN26E6327HTSA1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 300V |
|---|---|
| Vce Mætning (Max) @ Ib, Ic: | 500mV @ 2mA, 20mA |
| Transistor Type: | NPN |
| Leverandør Device Package: | PG-SOT23-3 |
| Serie: | - |
| Strøm - Max: | 360mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-236-3, SC-59, SOT-23-3 |
| Andre navne: | BFN 26 E6327 BFN 26 E6327-ND BFN 26 E6327TR-ND BFN26E6327 BFN26E6327BTSA1 BFN26E6327XT SP000014785 |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | BFN26E6327HTSA1 |
| Frekvens - Overgang: | 70MHz |
| Udvidet beskrivelse: | Bipolar (BJT) Transistor NPN 300V 200mA 70MHz 360mW Surface Mount PG-SOT23-3 |
| Beskrivelse: | TRANS NPN 300V 0.2A SOT-23 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 30 @ 30mA, 10V |
| Nuværende - Collector Cutoff (Max): | 100nA (ICBO) |
| Nuværende - Samler (Ic) (Max): | 200mA |
| Email: | [email protected] |
Relaterede dele til BFN26E6327HTSA1
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog