Købe BFP405FH6327XTSA1 med BYCHPS
Køb med garanti
BFP405FH6327XTSA1
- Varenummer:
- BFP405FH6327XTSA1
- Beskrivelse:
- TRANS RF NPN 4.5V 25MA TSFP-4
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12376 Pieces
- Datablad:
- BFP405FH6327XTSA1.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BFP405FH6327XTSA1, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BFP405FH6327XTSA1 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Leverandør Device Package: | 4-TSFP |
|---|---|
| Serie: | * |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 4-SMD, Flat Leads |
| Andre navne: | SP000745258 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 4 Weeks |
| Producentens varenummer: | BFP405FH6327XTSA1 |
| Udvidet beskrivelse: | RF Transistor Surface Mount 4-TSFP |
| Beskrivelse: | TRANS RF NPN 4.5V 25MA TSFP-4 |
| Email: | [email protected] |
Relaterede dele til BFP405FH6327XTSA1
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
BFP405E6433HTMA1 | Infineon Technologies | TRANSISTOR RF NPN 4.5V SOT-343 | Forespørgsel |
|
BFP405H6327XTSA1 | Infineon Technologies | TRANS RF NPN 4.5V 25MA SOT343 | Forespørgsel |
|
BFP405E6740HTSA1 | Infineon Technologies | TRANSISTOR NPN RF 4.5V SOT-343 | Forespørgsel |
 |
BFU520XRVL | NXP USA Inc. | TRANS RF NPN 12V 30MA SOT-143R | Forespørgsel |
|
BFP405H6740XTSA1 | Infineon Technologies | TRANS RF NPN 25GHZ 4.5V SOT343 | Forespørgsel |
|
BFP405E6327BTSA1 | Infineon Technologies | TRANS NPN RF 4.5V SOT-343 | Forespørgsel |
 |
MS2209 | Microsemi Corporation | TRANS RF BIPO 220W 7A M218 | Forespørgsel |
 |
BFR 183T E6327 | Infineon Technologies | TRANSISTOR RF NPN 12V SC-75 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers