Købe BFR31,215 med BYCHPS
Køb med garanti
BFR31,215
- Varenummer:
- BFR31,215
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- JFET N-CH 10MA 250MW SOT23
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17846 Pieces
- Datablad:
- BFR31,215.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BFR31,215, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BFR31,215 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Cutoff (VGS off) @ Id: | 2.5V @ 0.5nA |
|---|---|
| Leverandør Device Package: | SOT-23 (TO-236AB) |
| Serie: | - |
| Modstand - RDS (Til): | - |
| Strøm - Max: | 250mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | TO-236-3, SC-59, SOT-23-3 |
| Andre navne: | 568-6204-2 933163490215 BFR31 T/R BFR31 T/R-ND BFR31,215-ND BFR31215 |
| Driftstemperatur: | 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | BFR31,215 |
| Inputkapacitans (Ciss) (Max) @ Vds: | 4pF @ 10V |
| FET Type: | N-Channel |
| Udvidet beskrivelse: | JFET N-Channel 1mA @ 10V 250mW Surface Mount SOT-23 (TO-236AB) |
| Afløb til Source Voltage (VDSS): | 25V |
| Beskrivelse: | JFET N-CH 10MA 250MW SOT23 |
| Nuværende afløb (Id) - Maks: | 10mA |
| Nuværende - Afløb (Idss) @ Vds (Vgs = 0): | 1mA @ 10V |
| Email: | [email protected] |
Relaterede dele til BFR31,215
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
2SK33720TL | Panasonic Electronic Components | JFET N-CH 2MA 100MW SSSMINI-3P | Forespørgsel |
 |
BFR31,235 | NXP USA Inc. | JFET N-CH 10MA 250MW SOT23 | Forespørgsel |
 |
2N5115UB | Microsemi Corporation | P CHANNEL JFET | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers