Købe BFS 360L6 E6327 med BYCHPS
Køb med garanti
BFS 360L6 E6327
- Varenummer:
- BFS 360L6 E6327
- Beskrivelse:
- TRANSISTOR NPN 6V 35MA TSLP-6
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14068 Pieces
- Datablad:
- BFS 360L6 E6327.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BFS 360L6 E6327, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BFS 360L6 E6327 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 9V |
|---|---|
| Transistor Type: | 2 NPN (Dual) |
| Leverandør Device Package: | PG-TSLP-6 |
| Serie: | - |
| Strøm - Max: | 210mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 6-XFDFN |
| Andre navne: | BFS360L6E6327XT SP000013974 |
| Driftstemperatur: | 150°C (TJ) |
| Støjbillede (dB Typ @ f): | 1dB ~ 1.5dB @ 1.8GHz ~ 3GHz |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | BFS 360L6 E6327 |
| Gevinst: | 10dB ~ 14.5dB |
| Frekvens - Overgang: | 14GHz |
| Udvidet beskrivelse: | RF Transistor 2 NPN (Dual) 9V 35mA 14GHz 210mW Surface Mount PG-TSLP-6 |
| Beskrivelse: | TRANSISTOR NPN 6V 35MA TSLP-6 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 60 @ 15mA, 3V |
| Nuværende - Samler (Ic) (Max): | 35mA |
| Email: | [email protected] |
Relaterede dele til BFS 360L6 E6327
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers