Købe BKP0603TS330-T med BYCHPS
Køb med garanti
BKP0603TS330-T
- Varenummer:
- BKP0603TS330-T
- Fabrikant:
- Taiyo Yuden
- Beskrivelse:
- FERRITE BEAD,MULTILAYER CHIP,020
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12438 Pieces
- Datablad:
- BKP0603TS330-T.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BKP0603TS330-T, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BKP0603TS330-T via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Andre navne: | 587-5421-1 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | BKP0603TS330-T |
| Beskrivelse: | FERRITE BEAD,MULTILAYER CHIP,020 |
| Email: | [email protected] |
Relaterede dele til BKP0603TS330-T
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
BKP0603HS121-T | Taiyo Yuden | FERRITE BEAD 120 OHM 0201 1LN | Forespørgsel |
 |
BKP0603TM220-T | Taiyo Yuden | FERRITE BEAD,MULTILAYER CHIP,020 | Forespørgsel |
|
BKP0603HM220-T | Taiyo Yuden | FERRITE BEAD,MULTILAYER CHIP,020 | Forespørgsel |
|
BKP0603HM121-T | Taiyo Yuden | FERRITE BEAD 120 OHM 0201 1LN | Forespørgsel |
|
BKP0603HS220-T | Taiyo Yuden | FERRITE BEAD 22 OHM 0201 1LN | Forespørgsel |
|
BKP0603TS220-T | Taiyo Yuden | FERRITE BEAD,MULTILAYER CHIP,020 | Forespørgsel |
|
BKP0603HM330-T | Taiyo Yuden | FERRITE BEAD,MULTILAYER CHIP,020 | Forespørgsel |
|
BKP0603HS800-T | Taiyo Yuden | FERRITE BEAD 80 OHM 0201 1LN | Forespørgsel |
|
BKP0603HS100-T | Taiyo Yuden | FERRITE BEAD 10 OHM 0201 1LN | Forespørgsel |
|
BKP0603HM100-T | Taiyo Yuden | FERRITE BEAD 10 OHM 0201 1LN | Forespørgsel |
|
BKP0603HS330-T | Taiyo Yuden | FERRITE BEAD 33 OHM 0201 1LN | Forespørgsel |
|
BKP0603HM800-T | Taiyo Yuden | FERRITE BEAD 80 OHM 0201 1LN | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog