Købe BPS255IEC med BYCHPS
Køb med garanti
BPS255IEC
- Varenummer:
- BPS255IEC
- Fabrikant:
- Bussmann (Eaton)
- Beskrivelse:
- REPLACEMENT MODULE SPARKGAP 255V
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12658 Pieces
- Datablad:
- BPS255IEC.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BPS255IEC, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BPS255IEC via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - DC Spark Over (Nom): | 230V |
|---|---|
| Serie: | BPS |
| Emballage: | Bulk |
| Pakke / tilfælde: | Module |
| Antal polakker: | 4 |
| Monteringstype: | DIN Rail |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | BPS255IEC |
| Impulsudladningstrøm (8 / 20μs): | - |
| Fejl kort: | No |
| Udvidet beskrivelse: | Gas Discharge Tube 4 Pole DIN Rail |
| Beskrivelse: | REPLACEMENT MODULE SPARKGAP 255V |
| Email: | [email protected] |
Relaterede dele til BPS255IEC
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
GTCA35-421M-R05 | Littelfuse Inc. | GDT 420V 20% 5KA THROUGH HOLE | Forespørgsel |
 |
2095-450-BT1LF | Bourns Inc. | GDT 4500V 20% 5KA THROUGH HOLE | Forespørgsel |
 |
GTCS25-351M-R02 | Littelfuse Inc. | GDT 350V 20% 2.5KA SURFACE MOUNT | Forespørgsel |
 |
BPS255WE | Eaton | REPLACEMENT MODULE SPARKGAP 255V | Forespørgsel |
 |
SL1024A150C | Littelfuse Inc. | GDT 150V 10KA | Forespørgsel |
 |
2036-47-B2LF | Bourns Inc. | GDT 470V 20% 10KA THROUGH HOLE | Forespørgsel |
|
BSPS2255TT | Eaton | COMBND LIGHTNNG CURRENT & SURGE | Forespørgsel |
 |
2026-40-C2LF | Bourns Inc. | GDT 400V 20% 20KA THROUGH HOLE | Forespørgsel |
 |
9400320000 | Weidmuller | GDT 230V DIN RAIL | Forespørgsel |
 |
SL1021B400RF | Littelfuse Inc. | GDT 400V 20KA T/H FAIL SHORT | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog