Købe BU1850MUV-E2 med BYCHPS
Køb med garanti
BU1850MUV-E2
- Varenummer:
- BU1850MUV-E2
- Fabrikant:
- LAPIS Semiconductor
- Beskrivelse:
- IC I/O EXPANDER IAC 8B 16VQFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14061 Pieces
- Datablad:
- BU1850MUV-E2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BU1850MUV-E2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BU1850MUV-E2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 1.65 V ~ 3.6 V |
|---|---|
| Leverandør Device Package: | VQFN016V3030 |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 16-VFQFN Exposed Pad |
| Output Type: | Open Drain |
| Andre navne: | BU1850MUV-E2TR |
| Driftstemperatur: | -30°C ~ 85°C |
| Antal I / O: | 8 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | BU1850MUV-E2 |
| Afbryd output: | Yes |
| grænseflade: | I²C |
| Funktioner: | POR |
| Udvidet beskrivelse: | I/O Expander 8 I²C VQFN016V3030 |
| Beskrivelse: | IC I/O EXPANDER IAC 8B 16VQFN |
| Nuværende - Output Source / Sink: | - |
| Urfrekvens: | 400kHz |
| Email: | [email protected] |
Relaterede dele til BU1850MUV-E2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
PCA9536DGKR | Texas Instruments | IC I/O EXPANDER I2C 4B 8VSSOP | Forespørgsel |
 |
BU1852GXW-E2 | Rohm Semiconductor | IC GPIO KEY ENCODER 8X12 35-UBGA | Forespørgsel |
 |
MCP23S08-E/SS | Microchip Technology | IC I/O EXPANDER SPI 8B 20SSOP | Forespørgsel |
 |
CP82C55AZ | Intersil | IC I/O EXPANDER 24B 40DIP | Forespørgsel |
 |
IMS82C55AZ | Intersil | IC I/O EXPANDER 24B 44PLCC | Forespørgsel |
|
BU1852GUW-E2 | Rohm Semiconductor | IC EXPANDER GPIO 35VBGA | Forespørgsel |
|
BU1851GUW-E2 | Rohm Semiconductor | IC GPIO KEY ENCODER 8X8 35-VBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog