Købe BU6574FV-E2 med BYCHPS
Køb med garanti
BU6574FV-E2
- Varenummer:
- BU6574FV-E2
- Fabrikant:
- LAPIS Semiconductor
- Beskrivelse:
- IC ANALOG FRONT END SSOP20
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14116 Pieces
- Datablad:
- BU6574FV-E2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BU6574FV-E2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BU6574FV-E2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply, Digital: | 3.3V |
|---|---|
| Spænding - Supply, Analog: | 3.14 V ~ 3.47 V |
| Leverandør Device Package: | 20-SSOP-B |
| Serie: | - |
| Power (Watts): | 400mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 20-TSSOP (0.173", 4.40mm Width) |
| Andre navne: | BU6574FV-E2-ND BU6574FV-E2TR |
| Antal kanaler: | 1 |
| Antal bitter: | 16 |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | BU6574FV-E2 |
| Udvidet beskrivelse: | 1 Channel AFE 16 Bit 400mW 20-SSOP-B |
| Beskrivelse: | IC ANALOG FRONT END SSOP20 |
| Email: | [email protected] |
Relaterede dele til BU6574FV-E2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
BU6573FV-E2 | Rohm Semiconductor | IC ANALOG FRONT END SSOP | Forespørgsel |
 |
DS8005-RJX+ | Maxim Integrated | SMART CARD AFE DUAL 28TSSOP | Forespørgsel |
|
BU6577FV-E2 | Rohm Semiconductor | IC ANALOG FRONT END SSOP | Forespørgsel |
 |
ADS1294IPAGR | Texas Instruments | IC AFE 24BIT 32KSPS 4CH 64TQFP | Forespørgsel |
|
VSP5000PMG6 | Texas Instruments | IC CCD SIGNAL FRONT END 64-LQFP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers