Købe BU8732AKV-E2 med BYCHPS
Køb med garanti
BU8732AKV-E2
- Varenummer:
- BU8732AKV-E2
- Fabrikant:
- LAPIS Semiconductor
- Beskrivelse:
- IC CODEC PCM 48-VQFP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16048 Pieces
- Datablad:
- BU8732AKV-E2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BU8732AKV-E2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BU8732AKV-E2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Supply, Digital: | 2.7 V ~ 3.3 V |
|---|---|
| Spænding - Supply, Analog: | 2.7 V ~ 3.3 V |
| Type: | PCM |
| Leverandør Device Package: | 48-VQFP (7x7) |
| Sigma Delta: | No |
| Serie: | - |
| S / N-forhold, ADC'er / DAC'er (db) Typ: | - |
| Opløsning (bit): | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 48-LQFP |
| Andre navne: | BU8732AKVE2 |
| Driftstemperatur: | -30°C ~ 85°C |
| Antal ADC'er / DAC'er: | - |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | BU8732AKV-E2 |
| Udvidet beskrivelse: | PCM Interface 48-VQFP (7x7) |
| Dynamisk område, ADC'er / DAC'er (db) Typ: | - |
| Beskrivelse: | IC CODEC PCM 48-VQFP |
| Data Interface: | - |
| Email: | [email protected] |
Relaterede dele til BU8732AKV-E2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
W682388YG | Nuvoton Technology Corporation of America | IC PROG DUAL CODEC/SLCC 64-QFN | Forespørgsel |
 |
ADV7280BCPZ-M | Analog Devices Inc. | IC VIDEO DECODER SDTV 32-LFCSP | Forespørgsel |
 |
ADV212BBCZ-150 | Analog Devices Inc. | IC CODEC VID JPEG 2000 144CSBGA | Forespørgsel |
 |
NAU88L25YG | Nuvoton Technology Corporation of America | IC AUDIO CODEC STEREO 32QFN | Forespørgsel |
 |
IDT92HD71B5X3PRGXB3X8 | IDT, Integrated Device Technology Inc | IC AUDIO CODEC HD 4CH 48-TQFP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers