Købe BUB323Z med BYCHPS
Køb med garanti
BUB323Z
- Varenummer:
- BUB323Z
- Fabrikant:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- TRANS NPN DARL 350V 10A D2PAK
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 12406 Pieces
- Datablad:
- BUB323Z.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for BUB323Z, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til BUB323Z via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 350V |
|---|---|
| Vce Mætning (Max) @ Ib, Ic: | 1.7V @ 250mA, 10A |
| Transistor Type: | NPN - Darlington |
| Leverandør Device Package: | D2PAK |
| Serie: | - |
| Strøm - Max: | 150W |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Driftstemperatur: | -65°C ~ 175°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | BUB323Z |
| Frekvens - Overgang: | 2MHz |
| Udvidet beskrivelse: | Bipolar (BJT) Transistor NPN - Darlington 350V 10A 2MHz 150W Surface Mount D2PAK |
| Beskrivelse: | TRANS NPN DARL 350V 10A D2PAK |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 500 @ 5A, 4.6V |
| Nuværende - Collector Cutoff (Max): | 100µA |
| Nuværende - Samler (Ic) (Max): | 10A |
| Email: | [email protected] |
Relaterede dele til BUB323Z
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers