Købe C0402C224K9PAC7867 med BYCHPS
Køb med garanti
C0402C224K9PAC7867
- Varenummer:
- C0402C224K9PAC7867
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP CER 0.22UF 6.3V X5R 0402
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14562 Pieces
- Datablad:
- C0402C224K9PAC7867.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for C0402C224K9PAC7867, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til C0402C224K9PAC7867 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 6.3V |
|---|---|
| Tolerance: | ±10% |
| Tykkelse (Max): | 0.022" (0.55mm) |
| Temperaturkoefficient: | X5R |
| Størrelse / Dimension: | 0.039" L x 0.020" W (1.00mm x 0.50mm) |
| Serie: | C |
| Vurderinger: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0402 (1005 Metric) |
| Andre navne: | 399-11119-2 399-11119-2-ND 399-4886-2 C0402C224K9PAC C0402C224K9PAC7867-ND C0402C224K9PACTU Q5157380BB |
| Driftstemperatur: | -55°C ~ 85°C |
| Monteringstype: | Surface Mount, MLCC |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 22 Weeks |
| Producentens varenummer: | C0402C224K9PAC7867 |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | - |
| Fejlrate: | - |
| Udvidet beskrivelse: | 0.22µF ±10% 6.3V Ceramic Capacitor X5R 0402 (1005 Metric) |
| Beskrivelse: | CAP CER 0.22UF 6.3V X5R 0402 |
| kapacitans: | 0.22µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til C0402C224K9PAC7867
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers