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C0603C224J8NACTU
- Varenummer:
- C0603C224J8NACTU
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP CER 0.22UF 10V X8L 0603
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13134 Pieces
- Datablad:
- C0603C224J8NACTU.pdf
Introduktion
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specifikationer
| Spændingsvurdering: | 10V |
|---|---|
| Tolerance: | ±5% |
| Tykkelse (Max): | 0.034" (0.87mm) |
| Temperaturkoefficient: | X8L |
| Størrelse / Dimension: | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
| Serie: | C |
| Vurderinger: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0603 (1608 Metric) |
| Andre navne: | 399-5761-2 C0603C224J8NAC C0603C224J8NAC7867 |
| Driftstemperatur: | -55°C ~ 150°C |
| Monteringstype: | Surface Mount, MLCC |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 22 Weeks |
| Producentens varenummer: | C0603C224J8NACTU |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | High Temperature |
| Fejlrate: | - |
| Udvidet beskrivelse: | 0.22µF ±5% 10V Ceramic Capacitor X8L 0603 (1608 Metric) |
| Beskrivelse: | CAP CER 0.22UF 10V X8L 0603 |
| kapacitans: | 0.22µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
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C0603C224Z4VACTU | KEMET | CAP CER 0.22UF 16V Y5V 0603 | Forespørgsel |
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C0603C224K4RALTU | KEMET | CAP CER 0.22UF 16V X7R 0603 | Forespørgsel |
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C0603C224M3VACTU | KEMET | CAP CER 0.22UF 25V Y5V 0603 | Forespørgsel |
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C0603C224J3RECAUTO | KEMET | CAP CER 0603 220NF 25V X7R 5% | Forespørgsel |
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C0603C224J8RACTU | KEMET | CAP CER 0.22UF 10V X7R 0603 | Forespørgsel |
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C0603C224K4RAC7867 | KEMET | CAP CER 0.22UF 16V X7R 0603 | Forespørgsel |
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C0603C224M8VACTU | KEMET | CAP CER 0.22UF 10V Y5V 0603 | Forespørgsel |
|
C0603C224Z8VACTU | KEMET | CAP CER 0.22UF 10V Y5V 0603 | Forespørgsel |
|
C0603C224M4VACTU | KEMET | CAP CER 0.22UF 16V Y5V 0603 | Forespørgsel |
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C0603C224K8RACTU | KEMET | CAP CER 0.22UF 10V X7R 0603 | Forespørgsel |
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C0603C224M4RALTU | KEMET | CAP CER 0.22UF 16V X7R 0603 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers