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C0805C224K5NACAUTO
- Varenummer:
- C0805C224K5NACAUTO
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP CER 0.22UF 50V X8L 0805
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17155 Pieces
- Datablad:
- C0805C224K5NACAUTO.pdf
Introduktion
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specifikationer
| Spændingsvurdering: | 50V |
|---|---|
| Tolerance: | ±10% |
| Tykkelse (Max): | 0.055" (1.40mm) |
| Temperaturkoefficient: | X8L |
| Størrelse / Dimension: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Serie: | C |
| Vurderinger: | AEC-Q200 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0805 (2012 Metric) |
| Andre navne: | 399-12966-2 |
| Driftstemperatur: | -55°C ~ 150°C |
| Monteringstype: | Surface Mount, MLCC |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 11 Weeks |
| Producentens varenummer: | C0805C224K5NACAUTO |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | High Temperature |
| Fejlrate: | - |
| Udvidet beskrivelse: | 0.22µF ±10% 50V Ceramic Capacitor X8L 0805 (2012 Metric) |
| Beskrivelse: | CAP CER 0.22UF 50V X8L 0805 |
| kapacitans: | 0.22µF |
| Applikationer: | Automotive |
| Email: | [email protected] |
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C0805C224K4RACAUTO | KEMET | CAP CER 0.22UF 16V X7R 0805 | Forespørgsel |
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C0805C224Z4VACTU | KEMET | CAP CER 0.22UF 16V Y5V 0805 | Forespørgsel |
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C0805C224K3RACAUTO | KEMET | CAP CER 0.22UF 25V X7R 0805 | Forespørgsel |
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C0805C224M3RALTU | KEMET | CAP CER 0.22UF 25V X7R 0805 | Forespørgsel |
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C0805C224J3RACTU | KEMET | CAP CER 0.22UF 25V X7R 0805 | Forespørgsel |
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C0805C224J8RACTU | KEMET | CAP CER 0.22UF 10V X7R 0805 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers