Købe C1210H272JDGACTU med BYCHPS
Køb med garanti
C1210H272JDGACTU
- Varenummer:
- C1210H272JDGACTU
- Fabrikant:
- KEMET
- Beskrivelse:
- CAP CER 2700PF 1KV C0G/NP0 1210
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17640 Pieces
- Datablad:
- C1210H272JDGACTU.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for C1210H272JDGACTU, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til C1210H272JDGACTU via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 1000V (1kV) |
|---|---|
| Tolerance: | ±5% |
| Tykkelse (Max): | 0.110" (2.80mm) |
| Temperaturkoefficient: | C0G, NP0 |
| Størrelse / Dimension: | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
| Serie: | HV-HT |
| Vurderinger: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1210 (3225 Metric) |
| Andre navne: | 399-11274-2 C1210H272JDGAC C1210H272JDGAC7800 |
| Driftstemperatur: | -55°C ~ 200°C |
| Monteringstype: | Surface Mount, MLCC |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 22 Weeks |
| Producentens varenummer: | C1210H272JDGACTU |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | Low ESL, High Voltage, High Temperature |
| Fejlrate: | - |
| Udvidet beskrivelse: | 2700pF ±5% 1000V (1kV) Ceramic Capacitor C0G, NP0 1210 (3225 Metric) |
| Beskrivelse: | CAP CER 2700PF 1KV C0G/NP0 1210 |
| kapacitans: | 2700pF |
| Applikationer: | Downhole |
| Email: | [email protected] |
Relaterede dele til C1210H272JDGACTU
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers