Købe CBTD16212DL,112 med BYCHPS
Køb med garanti
CBTD16212DL,112
- Varenummer:
- CBTD16212DL,112
- Fabrikant:
- NXP Semiconductors / Freescale
- Beskrivelse:
- IC FET BUS EXCH SWCH 56-SSOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12606 Pieces
- Datablad:
- CBTD16212DL,112.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CBTD16212DL,112, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CBTD16212DL,112 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsforsyningskilde: | Single Supply |
|---|---|
| Spænding - Forsyning: | 4.5 V ~ 5.5 V |
| Type: | Bus FET Exchange Switch |
| Leverandør Device Package: | 56-SSOP |
| Serie: | 74CBTD |
| Emballage: | Tube |
| Pakke / tilfælde: | 56-BSSOP (0.295", 7.50mm Width) |
| Andre navne: | 935270187112 CBTD16212DL CBTD16212DL-ND |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | CBTD16212DL,112 |
| Uafhængige kredsløb: | 1 |
| Udvidet beskrivelse: | Bus FET Exchange Switch 12 x 2:2 56-SSOP |
| Beskrivelse: | IC FET BUS EXCH SWCH 56-SSOP |
| Nuværende - Output High, Low: | - |
| Kredsløb: | 12 x 2:2 |
| Email: | [email protected] |
Relaterede dele til CBTD16212DL,112
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
CBTD16213DL,512 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-SSOP | Forespørgsel |
 |
CBTD16213DGG,112 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-TSSOP | Forespørgsel |
|
CBTD16212DGG,112 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-TSSOP | Forespørgsel |
|
CBTD16212DL,118 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-SSOP | Forespørgsel |
|
CBTD16212DGG,118 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-TSSOP | Forespørgsel |
|
CBTD16213DL,518 | NXP USA Inc. | IC FET BUS EXCH SWCH 56-SSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers