Købe CD42FD223JO3+GXZ med BYCHPS
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CD42FD223JO3+GXZ
- Varenummer:
- CD42FD223JO3+GXZ
- Fabrikant:
- Cornell Dubilier Electronics
- Beskrivelse:
- MICA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14000 Pieces
- Datablad:
- CD42FD223JO3+GXZ.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CD42FD223JO3+GXZ, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CD42FD223JO3+GXZ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | * |
|---|---|
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 9 Weeks |
| Producentens varenummer: | CD42FD223JO3+GXZ |
| Udvidet beskrivelse: | Capacitor |
| Beskrivelse: | MICA |
| Email: | [email protected] |
Relaterede dele til CD42FD223JO3+GXZ
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
CD42FD223JO3 | Cornell Dubilier Electronics (CDE) | CAP MICA 0.022UF 5% 500V RADIAL | Forespørgsel |
|
CD42FD223FO3 | Cornell Dubilier Electronics (CDE) | CAP MICA 0.022UF 1% 500V RADIAL | Forespørgsel |
|
CD42FD223GO3 | Cornell Dubilier Electronics (CDE) | CAP MICA 0.022UF 2% 500V RADIAL | Forespørgsel |
|
CD42FD223FO3F | Cornell Dubilier Electronics (CDE) | CAP MICA 0.022UF 1% 500V RADIAL | Forespørgsel |
|
CD42FD223JO3F | Cornell Dubilier Electronics (CDE) | CAP MICA 0.022UF 5% 500V RADIAL | Forespørgsel |
|
CD42FD223GO3F | Cornell Dubilier Electronics (CDE) | CAP MICA 0.022UF 2% 500V RADIAL | Forespørgsel |
 |
CD42FD223JO3+2XX | Cornell Dubilier Electronics (CDE) | MICA | Forespørgsel |
|
CD42FD203JO3F | Cornell Dubilier Electronics (CDE) | CAP MICA 0.02UF 5% 500V RADIAL | Forespørgsel |
|
CD42FD243JO3 | Cornell Dubilier Electronics (CDE) | CAP MICA 0.024UF 5% 500V RADIAL | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
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- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers