Købe CDHC221K2R3SR med BYCHPS
Køb med garanti
CDHC221K2R3SR
- Varenummer:
- CDHC221K2R3SR
- Fabrikant:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP 220F -5% +10% 2.3V T/H
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19657 Pieces
- Datablad:
- CDHC221K2R3SR.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CDHC221K2R3SR, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CDHC221K2R3SR via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 2.3V |
|---|---|
| Tolerance: | -5%, +10% |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | 0.866" Dia (22.00mm) |
| Serie: | CDHC |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Snap-In |
| Driftstemperatur: | -40°C ~ 60°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | CDHC221K2R3SR |
| Levetid @ Temp.: | 1000 Hrs @ 50°C |
| Blyafstand: | 0.394" (10.00mm) |
| Højde - Siddende (Max): | 1.850" (47.00mm) |
| Udvidet beskrivelse: | 220F -5%, +10%(EDLC) Supercapacitor 2.3V Radial, Can - Snap-In 40 mOhm 1000 Hrs @ 50°C |
| ESR (Equivalent Series Resistance): | 40 mOhm |
| Beskrivelse: | CAP 220F -5% +10% 2.3V T/H |
| kapacitans: | 220F |
| Email: | [email protected] |
Relaterede dele til CDHC221K2R3SR
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
SCCR16B205SRB | AVX Corporation | CAPACITOR 2F 2.7V THRU HOLE | Forespørgsel |
 |
KR-5R5H155-R | Eaton | CAP 1.5F -20% +80% 5.5V T/H | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers