Købe CDK1308BILP40 med BYCHPS
Køb med garanti
CDK1308BILP40
- Varenummer:
- CDK1308BILP40
- Fabrikant:
- Exar Corporation
- Beskrivelse:
- IC ADC 10BIT 40MSPS 40QFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16624 Pieces
- Datablad:
- CDK1308BILP40.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CDK1308BILP40, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CDK1308BILP40 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Leverandør Device Package: | 40-QFN (6x6) |
|---|---|
| Serie: | * |
| Emballage: | Tray |
| Pakke / tilfælde: | 40-VFQFN Exposed Pad |
| Fugtfølsomhedsniveau (MSL): | 2A (4 Weeks) |
| Producentens varenummer: | CDK1308BILP40 |
| Udvidet beskrivelse: | Bit Analog to Digital Converter Input 40-QFN (6x6) |
| Beskrivelse: | IC ADC 10BIT 40MSPS 40QFN |
| Email: | [email protected] |
Relaterede dele til CDK1308BILP40
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
CDK1307CILP40 | Exar Corporation | IC ADC 12/13BIT 65MSPS 40QFN | Forespørgsel |
|
CDK1308DILP40 | Exar Corporation | IC ADC 10BIT 80MSPS 40QFN | Forespørgsel |
 |
LTC1197LCMS8#TRPBF | Linear Technology | IC ADC 10BIT 250KHZ W/SD 8-MSOP | Forespørgsel |
|
CDK1307AILP40 | Exar Corporation | IC ADC 12/13BIT 20MSPS 40QFN | Forespørgsel |
|
CDK1308CILP40 | Exar Corporation | IC ADC 10BIT 65MSPS 40QFN | Forespørgsel |
 |
MAX11125ATI+T | Maxim Integrated | IC ADC 12BIT SRL 1MSPS 28TQFN | Forespørgsel |
|
CDK1308AILP40 | Exar Corporation | IC ADC 10BIT 20MSPS 40QFN | Forespørgsel |
|
CDK1307BILP40 | Exar Corporation | IC ADC 12/13BIT 40MSPS 40QFN | Forespørgsel |
|
CDK1307DILP40 | Exar Corporation | IC ADC 12/13BIT 80MSPS 40QFN | Forespørgsel |
 |
5962-9063201M3A | Analog Devices Inc. | IC ADC 12BIT SAMPLING 28CLCC | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers