Købe CGA1206MLA-16701E med BYCHPS
Køb med garanti
CGA1206MLA-16701E
- Varenummer:
- CGA1206MLA-16701E
- Fabrikant:
- Bourns, Inc.
- Beskrivelse:
- VARISTOR 22.5V 200A 1206
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 16956 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for CGA1206MLA-16701E, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CGA1206MLA-16701E via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Varistor Spænding (Typ): | 22.5V |
|---|---|
| Varistor Spænding (Min): | 19.8V |
| Varistor Spænding (Max): | 25.2V |
| Serie: | ChipGuard® |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1206 (3216 Metric) |
| Driftstemperatur: | -55°C ~ 125°C (TA) |
| Antal kredsløb: | 1 |
| Monteringstype: | Surface Mount, MLCV |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Maksimal DC Volt: | 16VDC |
| Maks. Vekselstrøm: | 14VAC |
| Fabrikantens standard ledetid: | 17 Weeks |
| Producentens varenummer: | CGA1206MLA-16701E |
| Energi: | 0.50J |
| Beskrivelse: | VARISTOR 22.5V 200A 1206 |
| Nuværende - Overspænding: | 200A |
| Kapacitans @ Frekvens: | 700pF @ 1kHz |
| Email: | [email protected] |
Relaterede dele til CGA1206MLA-16701E
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
CGA1206MLA-31551E | Bourns Inc. | VARISTOR 39.5V 200A 1206 | Forespørgsel |
|
CGA1206MLA-40181E | Bourns Inc. | VARISTOR 70V 200A 1206 | Forespørgsel |
|
CGA1206MLA-26601E | Bourns Inc. | VARISTOR 33.5V 200A 1206 | Forespørgsel |
|
CGA1206MLA-16801E | Bourns Inc. | VARISTOR 25V 200A 1206 | Forespørgsel |
|
CGA1206MLA-38501E | Bourns Inc. | VARISTOR 47.5V 200A 1206 | Forespørgsel |
|
CGA1206MLA-22841E | Bourns Inc. | VARISTOR 27V 100A 1206 | Forespørgsel |
|
CGA1206MLA-22651E | Bourns Inc. | VARISTOR 27.5V 200A 1206 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers