Købe CGA4J1X8R1E684K125AE med BYCHPS
Køb med garanti
CGA4J1X8R1E684K125AE
- Varenummer:
- CGA4J1X8R1E684K125AE
- Fabrikant:
- TDK Corporation
- Beskrivelse:
- CAP CER 0.68UF 25V X8R 0805
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13496 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for CGA4J1X8R1E684K125AE, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CGA4J1X8R1E684K125AE via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 25V |
|---|---|
| Tolerance: | ±10% |
| Tykkelse (Max): | 0.059" (1.50mm) |
| Temperaturkoefficient: | X8R |
| Størrelse / Dimension: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Serie: | CGA |
| Vurderinger: | AEC-Q200 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0805 (2012 Metric) |
| Andre navne: | 445-174805-2 CGA4J1X8R1E684KT0Y0S |
| Driftstemperatur: | -55°C ~ 150°C |
| Monteringstype: | Surface Mount, MLCC |
| Producentens varenummer: | CGA4J1X8R1E684K125AE |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | Soft Termination, High Temperature |
| Fejlrate: | - |
| Udvidet beskrivelse: | 0.68µF ±10% 25V Ceramic Capacitor X8R 0805 (2012 Metric) |
| Beskrivelse: | CAP CER 0.68UF 25V X8R 0805 |
| kapacitans: | 0.68µF |
| Applikationer: | Automotive |
| Email: | [email protected] |
Relaterede dele til CGA4J1X8R1E684K125AE
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
CGA4J1X8R1E684K125AC | TDK Corporation | CAP CER 0.68UF 25V X8R 0805 | Forespørgsel |
|
CGA4J1X8R1E105K125AD | TDK Corporation | CAP CER 1UF 25V X8R 0805 | Forespørgsel |
|
CGA4J1X8R1E105K125AE | TDK Corporation | CAP CER 1UF 25V X8R 0805 | Forespørgsel |
|
CGA4J1X8R1E684K125AD | TDK Corporation | CAP CER 0.68UF 25V X8R 0805 | Forespørgsel |
|
CGA4J1X8R1E105K125AC | TDK Corporation | CAP CER 1UF 25V X8R 0805 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog