Købe CGA6P2X8R1E335K250AE med BYCHPS
Køb med garanti
CGA6P2X8R1E335K250AE
- Varenummer:
- CGA6P2X8R1E335K250AE
- Fabrikant:
- TDK Corporation
- Beskrivelse:
- CAP CER 3.3UF 25V X8R 1210
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13710 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for CGA6P2X8R1E335K250AE, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CGA6P2X8R1E335K250AE via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 25V |
|---|---|
| Tolerance: | ±10% |
| Tykkelse (Max): | 0.110" (2.80mm) |
| Temperaturkoefficient: | X8R |
| Størrelse / Dimension: | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
| Serie: | CGA |
| Vurderinger: | AEC-Q200 |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1210 (3225 Metric) |
| Andre navne: | 445-174817-2 CGA6P2X8R1E335KT0Y0S |
| Driftstemperatur: | -55°C ~ 150°C |
| Monteringstype: | Surface Mount, MLCC |
| Producentens varenummer: | CGA6P2X8R1E335K250AE |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | Soft Termination, High Temperature |
| Fejlrate: | - |
| Udvidet beskrivelse: | 3.3µF ±10% 25V Ceramic Capacitor X8R 1210 (3225 Metric) |
| Beskrivelse: | CAP CER 3.3UF 25V X8R 1210 |
| kapacitans: | 3.3µF |
| Applikationer: | Automotive |
| Email: | [email protected] |
Relaterede dele til CGA6P2X8R1E335K250AE
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
CGA6P2X8R1E335M250AA | TDK Corporation | CAP CER 3.3UF 25V X8R 1210 | Forespørgsel |
|
CGA6P2X8R1E335K250AA | TDK Corporation | CAP CER 3.3UF 25V X8R 1210 | Forespørgsel |
 |
CGA6P2X8R1E335K250AD | TDK Corporation | CAP CER 3.3UF 25V X8R 1210 | Forespørgsel |
|
CGA6P2X8R1E335M250AD | TDK Corporation | CAP CER 3.3UF 25V X8R 1210 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers