Købe CGADN3X7R1E476M230LE med BYCHPS
Køb med garanti
CGADN3X7R1E476M230LE
- Varenummer:
- CGADN3X7R1E476M230LE
- Fabrikant:
- TDK Corporation
- Beskrivelse:
- CAP CER 47UF 25V X7R NONSTND
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14230 Pieces
- Datablad:
- CGADN3X7R1E476M230LE.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CGADN3X7R1E476M230LE, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CGADN3X7R1E476M230LE via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 25V |
|---|---|
| Tolerance: | ±20% |
| Tykkelse (Max): | 0.098" (2.50mm) |
| Temperaturkoefficient: | X7R |
| Størrelse / Dimension: | 0.295" L x 0.248" W (7.50mm x 6.30mm) |
| Serie: | CGA |
| Vurderinger: | AEC-Q200 |
| Emballage: | Original-Reel® |
| Pakke / tilfælde: | 3025 (7563 Metric) |
| Andre navne: | 445-172989-6 |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount, MLCC |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | CGADN3X7R1E476M230LE |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | Soft Termination |
| Fejlrate: | - |
| Udvidet beskrivelse: | 47µF ±20% 25V Ceramic Capacitor X7R 3025 (7563 Metric) |
| Beskrivelse: | CAP CER 47UF 25V X7R NONSTND |
| kapacitans: | 47µF |
| Applikationer: | Automotive, Boardflex Sensitive |
| Email: | [email protected] |
Relaterede dele til CGADN3X7R1E476M230LE
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog