Købe CGB3S3X5R0G106M050AB med BYCHPS
Køb med garanti
CGB3S3X5R0G106M050AB
- Varenummer:
- CGB3S3X5R0G106M050AB
- Fabrikant:
- TDK Corporation
- Beskrivelse:
- CAP CER 10UF 4V X5R 0603
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19900 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for CGB3S3X5R0G106M050AB, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CGB3S3X5R0G106M050AB via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 4V |
|---|---|
| Tolerance: | ±20% |
| Tykkelse (Max): | 0.020" (0.50mm) |
| Temperaturkoefficient: | X5R |
| Størrelse / Dimension: | 0.063" L x 0.031" W (1.60mm x 0.80mm) |
| Serie: | CGB |
| Vurderinger: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0603 (1608 Metric) |
| Andre navne: | 445-15968-2 CGB3S3X5R0G106M050ABTR CGB3S3X5R0G106M050ABTR-ND CGB3S3X5R0G106MT000N |
| Driftstemperatur: | -55°C ~ 85°C |
| Monteringstype: | Surface Mount, MLCC |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | CGB3S3X5R0G106M050AB |
| Lead Style: | - |
| Blyafstand: | - |
| Højde - Siddende (Max): | - |
| Funktioner: | Low Profile |
| Fejlrate: | - |
| Udvidet beskrivelse: | 10µF ±20% 4V Ceramic Capacitor X5R 0603 (1608 Metric) |
| Beskrivelse: | CAP CER 10UF 4V X5R 0603 |
| kapacitans: | 10µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til CGB3S3X5R0G106M050AB
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog