Købe CM322522-3R9KL med BYCHPS
Køb med garanti
CM322522-3R9KL
- Varenummer:
- CM322522-3R9KL
- Fabrikant:
- Bourns, Inc.
- Beskrivelse:
- FIXED IND 3.9UH 175MA 1.3 OHM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19681 Pieces
- Datablad:
- CM322522-3R9KL.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CM322522-3R9KL, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CM322522-3R9KL via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Wirewound |
|---|---|
| Tolerance: | ±10% |
| Leverandør Device Package: | 1210 |
| Størrelse / Dimension: | 0.126" L x 0.098" W (3.20mm x 2.50mm) |
| Afskærmning: | Unshielded |
| Serie: | CM322522 |
| Vurderinger: | - |
| Q @ Freq: | 30 @ 7.96MHz |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 1210 (3225 Metric) |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Materiale - Core: | Ferrite |
| Fabrikantens standard ledetid: | 18 Weeks |
| Producentens varenummer: | CM322522-3R9KL |
| selvinduktion: | 3.9µH |
| Højde - Siddende (Max): | 0.087" (2.20mm) |
| Frekvens - Test: | 7.96MHz |
| Frekvens - Selvresonans: | 60MHz |
| Udvidet beskrivelse: | 3.9µH Unshielded Wirewound Inductor 175mA 1.3 Ohm Max 1210 (3225 Metric) |
| Beskrivelse: | FIXED IND 3.9UH 175MA 1.3 OHM |
| DC-resistens (DCR): | 1.3 Ohm Max |
| Nuværende vurdering: | 175mA |
| Nuværende - Mætning: | - |
| Email: | [email protected] |
Relaterede dele til CM322522-3R9KL
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers