Købe CUDD16-08C TR13 med BYCHPS
Køb med garanti
CUDD16-08C TR13
- Varenummer:
- CUDD16-08C TR13
- Fabrikant:
- Central Semiconductor
- Beskrivelse:
- DIODE GEN PURP 800V 16A DPAK
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19906 Pieces
- Datablad:
- CUDD16-08C TR13.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for CUDD16-08C TR13, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til CUDD16-08C TR13 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Videresend (Vf) (Max) @ Hvis: | 1.5V @ 8A |
|---|---|
| Spænding - DC-omvendt (Vr) (Max): | 800V |
| Leverandør Device Package: | DPAK |
| Fart: | Fast Recovery = 200mA (Io) |
| Serie: | - |
| Reverse Recovery Time (trr): | 50ns |
| Emballage: | Original-Reel® |
| Pakke / tilfælde: | TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Andre navne: | CUDD16-08C TR13DKR |
| Driftstemperatur - Junction: | -65°C ~ 150°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 12 Weeks |
| Producentens varenummer: | CUDD16-08C TR13 |
| Udvidet beskrivelse: | Diode Array 1 Pair Common Cathode Standard 800V 16A Surface Mount TO-252-3, DPak (2 Leads + Tab), SC-63 |
| Diodetype: | Standard |
| Diode Konfiguration: | 1 Pair Common Cathode |
| Beskrivelse: | DIODE GEN PURP 800V 16A DPAK |
| Nuværende - Reverse Lækage @ Vr: | 10µA @ 800V |
| Nuværende - Gennemsnitlig Rectified (Io) (pr. Diode): | 16A |
| Email: | [email protected] |
Relaterede dele til CUDD16-08C TR13
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers