Købe DD1274AS-H-5R6N=P3 med BYCHPS
Køb med garanti
DD1274AS-H-5R6N=P3
- Varenummer:
- DD1274AS-H-5R6N=P3
- Fabrikant:
- Murata Electronics
- Beskrivelse:
- FIXED IND 5.6UH 6.3A 18.3 MOHM
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17776 Pieces
- Datablad:
- DD1274AS-H-5R6N=P3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DD1274AS-H-5R6N=P3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DD1274AS-H-5R6N=P3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Type: | Wirewound |
|---|---|
| Tolerance: | ±30% |
| Størrelse / Dimension: | 0.394" L x 0.394" W (10.00mm x 10.00mm) |
| Afskærmning: | Shielded |
| Serie: | DEM10050C |
| Vurderinger: | AEC-Q200 |
| Q @ Freq: | - |
| Emballage: | Original-Reel® |
| Pakke / tilfælde: | Nonstandard |
| Andre navne: | 490-13187-6 |
| Driftstemperatur: | - |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Materiale - Core: | Ferrite |
| Fabrikantens standard ledetid: | 13 Weeks |
| Producentens varenummer: | DD1274AS-H-5R6N=P3 |
| selvinduktion: | 5.6µH |
| Højde - Siddende (Max): | 0.197" (5.00mm) |
| Frekvens - Test: | 100kHz |
| Frekvens - Selvresonans: | - |
| Udvidet beskrivelse: | 5.6µH Shielded Wirewound Inductor 6.3A 18.3 mOhm Max Nonstandard |
| Beskrivelse: | FIXED IND 5.6UH 6.3A 18.3 MOHM |
| DC-resistens (DCR): | 18.3 mOhm Max |
| Nuværende vurdering: | 6.3A |
| Nuværende - Mætning: | 11.1A |
| Email: | [email protected] |
Relaterede dele til DD1274AS-H-5R6N=P3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers