Købe DMJ70H1D3SH3 med BYCHPS
Køb med garanti
DMJ70H1D3SH3
- Varenummer:
- DMJ70H1D3SH3
- Fabrikant:
- Diodes Incorporated
- Beskrivelse:
- MOSFET BVDSS: 651V 800V TO251
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 13920 Pieces
- Datablad:
- DMJ70H1D3SH3.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DMJ70H1D3SH3, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DMJ70H1D3SH3 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Vgs (th) (Max) @ Id: | 4V @ 250µA |
|---|---|
| Vgs (Max): | ±30V |
| Teknologi: | MOSFET (Metal Oxide) |
| Leverandør Device Package: | TO-251 |
| Serie: | - |
| Rds On (Max) @ Id, Vgs: | 1.3 Ohm @ 2.5A, 10V |
| Power Dissipation (Max): | 41W (Tc) |
| Emballage: | Tube |
| Pakke / tilfælde: | TO-251-3 Stub Leads, IPak |
| Andre navne: | DMJ70H1D3SH3-ND |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | DMJ70H1D3SH3 |
| Inputkapacitans (Ciss) (Max) @ Vds: | 351pF @ 50V |
| Gate Charge (Qg) (Max) @ Vgs: | 13.9nC @ 10V |
| FET Type: | N-Channel |
| FET-funktion: | - |
| Udvidet beskrivelse: | N-Channel 700V 4.6A (Tc) 41W (Tc) Through Hole TO-251 |
| Drevspænding (Maks. Rds On, Min Rds On): | 10V |
| Afløb til Source Voltage (VDSS): | 700V |
| Beskrivelse: | MOSFET BVDSS: 651V 800V TO251 |
| Strøm - Kontinuerlig afløb (Id) @ 25 ° C: | 4.6A (Tc) |
| Email: | [email protected] |
Relaterede dele til DMJ70H1D3SH3
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers