Købe DS1390U-3+ med BYCHPS
Køb med garanti
DS1390U-3+
- Varenummer:
- DS1390U-3+
- Fabrikant:
- Maxim Integrated
- Beskrivelse:
- IC RTC CLK/CALENDAR SPI 10-USOP
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 12818 Pieces
- Datablad:
- 1.DS1390U-3+.pdf2.DS1390U-3+.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DS1390U-3+, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DS1390U-3+ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning, Batteri: | 1.3 V ~ 3.7 V |
|---|---|
| Spænding - Forsyning: | 2.7 V ~ 3.3 V |
| Type: | Clock/Calendar |
| Tidsformat: | HH:MM:SS:hh (12/24 hr) |
| Leverandør Device Package: | 10-µSOP |
| Serie: | - |
| Emballage: | Tube |
| Pakke / tilfælde: | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
| Andre navne: | DS1390U3 |
| Driftstemperatur: | -40°C ~ 85°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Hukommelsesstørrelse: | - |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | DS1390U-3+ |
| grænseflade: | SPI |
| Funktioner: | Alarm, Leap Year, Square Wave Output, Trickle-Charger |
| Udvidet beskrivelse: | Real Time Clock (RTC) IC Clock/Calendar SPI 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
| Beskrivelse: | IC RTC CLK/CALENDAR SPI 10-USOP |
| Datoformat: | YY-MM-DD-dd |
| Nuværende - Timekeeping (Max): | 125µA @ 2.7V ~ 3.3V |
| Email: | [email protected] |
Relaterede dele til DS1390U-3+
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog