Købe DS24B33Q+T&R med BYCHPS
Køb med garanti
DS24B33Q+T&R
- Varenummer:
- DS24B33Q+T&R
- Fabrikant:
- Maxim Integrated
- Beskrivelse:
- IC EEPROM 4KBIT 1WIRE 6TDFN
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17970 Pieces
- Datablad:
- DS24B33Q+T&R.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DS24B33Q+T&R, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DS24B33Q+T&R via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 2.8 V ~ 5.25 V |
|---|---|
| Leverandør Device Package: | 6-TDFN-EP (3x3) |
| Fart: | - |
| Serie: | - |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 6-WDFN Exposed Pad |
| Andre navne: | DS24B33Q+T&R-ND |
| Driftstemperatur: | -40°C ~ 85°C (TA) |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Hukommelsestype: | Non-Volatile |
| Hukommelsesstørrelse: | 4Kb (256 x 16) |
| Hukommelsesformat: | EEPROM |
| Fabrikantens standard ledetid: | 6 Weeks |
| Producentens varenummer: | DS24B33Q+T&R |
| grænseflade: | 1-Wire® Serial |
| Beskrivelse: | IC EEPROM 4KBIT 1WIRE 6TDFN |
| Email: | [email protected] |
Relaterede dele til DS24B33Q+T&R
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
DS24B33Q+U | Maxim Integrated | IC EEPROM 4KBIT 1WIRE 6TDFN | Forespørgsel |
 |
DS24B33+ | Maxim Integrated | IC EEPROM 4KBIT 1WIRE TO92-3 | Forespørgsel |
 |
DS24B33S+T&R | Maxim Integrated | IC EEPROM 4KBIT 1WIRE 8SO | Forespørgsel |
|
DS24B33S+ | Maxim Integrated | IC EEPROM 4KBIT 1WIRE 8SO | Forespørgsel |
 |
DS24B33G+T&R | Maxim Integrated | IC EEPROM 4KBIT 1WIRE 2SFN | Forespørgsel |
|
DS24B33G+U | Maxim Integrated | IC EEPROM 4KBIT 1WIRE 2SFN | Forespørgsel |
 |
DS24B33+T&R | Maxim Integrated | IC EEPROM 4KBIT 1WIRE TO92-3 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers