Købe DS26401NA2 med BYCHPS
Køb med garanti
DS26401NA2
- Varenummer:
- DS26401NA2
- Fabrikant:
- Maxim Integrated
- Beskrivelse:
- IC FRAMER OCTAL T1/E1 CSBGA
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 14312 Pieces
- Datablad:
- DS26401NA2.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DS26401NA2, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DS26401NA2 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 3.135 V ~ 3.465 V |
|---|---|
| Leverandør Device Package: | 256-CSBGA (17x17) |
| Serie: | - |
| Power (Watts): | - |
| Emballage: | Tray |
| Pakke / tilfælde: | 256-LBGA, CSBGA |
| Driftstemperatur: | 0°C ~ 70°C |
| Antal kredsløb: | 8 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Producentens varenummer: | DS26401NA2 |
| grænseflade: | WAN |
| Inkluderer: | - |
| Fungere: | - |
| Udvidet beskrivelse: | Telecom IC 256-CSBGA (17x17) |
| Beskrivelse: | IC FRAMER OCTAL T1/E1 CSBGA |
| Nuværende - Forsyning: | 275mA |
| Email: | [email protected] |
Relaterede dele til DS26401NA2
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
DS26401NA2+ | Maxim Integrated | IC OCTAL FRAMER T1/E1/J1 256BGA | Forespørgsel |
 |
CYV15G0401DXB-BGI | Cypress Semiconductor Corp | IC TXRX HOTLINK II QUAD 256LBGA | Forespørgsel |
|
DS26401A2+ | Maxim Integrated | IC OCTAL FRAMER T1/E1/J1 256BGA | Forespørgsel |
|
DS26401+ | Maxim Integrated | IC OCTAL FRAMER T1/E1/J1 256BGA | Forespørgsel |
|
DS26401N+ | Maxim Integrated | IC OCTAL FRAMER T1/E1/J1 256-BGA | Forespørgsel |
 |
DS26401A2 | Maxim Integrated | IC FRAMER OCTAL T1/E1 CSBGA | Forespørgsel |
|
DS26401 | Maxim Integrated | IC FRAMER OCTAL T1/E1 CSBGA | Forespørgsel |
 |
TS117PTR | IXYS Integrated Circuits Division | IC RELAY OPTO 120MA 8 FLTPK | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog