Købe DZ2700BEZ med BYCHPS
Køb med garanti
DZ2700BEZ
- Varenummer:
- DZ2700BEZ
- Fabrikant:
- Littelfuse
- Beskrivelse:
- GAUGE RING ACS DI 20A 500V BLUE
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 13673 Pieces
- Datablad:
- DZ2700BEZ.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DZ2700BEZ, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DZ2700BEZ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | - |
|---|---|
| Andre navne: | DZ27BE |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | DZ2700BEZ |
| Til brug med / relaterede produkter: | Fuse; Diazed |
| Beskrivelse: | GAUGE RING ACS DI 20A 500V BLUE |
| Tilbehørstype: | Gauge Ring, Blue |
| Email: | [email protected] |
Relaterede dele til DZ2700BEZ
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
2839279 | Phoenix Contact | BASE ELEMENT | Forespørgsel |
 |
DZ2700YWZ | Littelfuse Inc. | GAUGE RING ACS 25A 500V YELLOW | Forespørgsel |
|
DZ2700GNZ | Littelfuse Inc. | GAUGE RING ACS DII 6A 500V GREEN | Forespørgsel |
|
DZ2700RDZ | Littelfuse Inc. | GAUGE RING ACS DII 10A 500V RED | Forespørgsel |
|
2905591 | Phoenix Contact | SPARK GAP | Forespørgsel |
|
DZ2700PKZ | Littelfuse Inc. | GAUGE RING ACS DII 2A 500V PINK | Forespørgsel |
 |
TI1500 | Eaton | TRIP INDICATOR 1500V 120.8MM | Forespørgsel |
|
DZ2700GYZ | Littelfuse Inc. | GAUGE RING ACS DII 16A 500V GREY | Forespørgsel |
|
2A1918-1 | Eaton | KIT BLANK BRANCH COVERS 60A | Forespørgsel |
|
00970035Z | Littelfuse Inc. | FUSEPULLER MINI | Forespørgsel |
|
DZ2700BRZ | Littelfuse Inc. | GAUGE RING ACS DII 4A 500V BROWN | Forespørgsel |
|
GV2G05 | Eaton | TERM BLOCK 63A OPM FUSE HLDR | Forespørgsel |
 |
03450101HX020 | Littelfuse Inc. | FUSE HOLDER KNOB GREY 3AG | Forespørgsel |
 |
4311.9601 | Schurter Inc. | BLANK COVER HN 14.103 | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers