Købe DZ3300BKZ med BYCHPS
Køb med garanti
DZ3300BKZ
- Varenummer:
- DZ3300BKZ
- Fabrikant:
- Littelfuse
- Beskrivelse:
- GAUGE RING ACS 500V 35A DIII BLK
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 16682 Pieces
- Datablad:
- DZ3300BKZ.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for DZ3300BKZ, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til DZ3300BKZ via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Serie: | - |
|---|---|
| Andre navne: | DZ33BK |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | DZ3300BKZ |
| Til brug med / relaterede produkter: | Fuse; Diazed |
| Beskrivelse: | GAUGE RING ACS 500V 35A DIII BLK |
| Tilbehørstype: | Gauge Ring, Black |
| Email: | [email protected] |
Relaterede dele til DZ3300BKZ
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
03540534Z | Littelfuse Inc. | COVER SPLASH PROOF - 4POS FUSE M | Forespørgsel |
|
DZ3300WEZ | Littelfuse Inc. | GAUGE RING ACS 500V 50A DIII WHI | Forespørgsel |
 |
00970024M | Littelfuse Inc. | FUSE EXTRACTOR MINI ATO 297 | Forespørgsel |
|
905-010 | Littelfuse Inc. | FUSE LOCKWASHER STEEL 0.883" | Forespørgsel |
|
DZ3300CRZ | Littelfuse Inc. | GAUGE RING ACS 500V 63A DIII COP | Forespørgsel |
 |
2098164-4 | TE Connectivity AMP Connectors | COVER, 60 POS | Forespørgsel |
 |
3521C | Keystone Electronics | FUSEBLOCK COVER FOR 2AG PVC | Forespørgsel |
|
DZ2700GNZ | Littelfuse Inc. | GAUGE RING ACS DII 6A 500V GREEN | Forespørgsel |
 |
X21066301 | E-T-A | COVER RUBBER FOR 3400 SERIES | Forespørgsel |
|
255.0808.2001 | Littelfuse Inc. | INSULATION NUT CF FUSE M8 BOLT | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers