Købe E32D630HPN104MEA5N med BYCHPS
Køb med garanti
E32D630HPN104MEA5N
- Varenummer:
- E32D630HPN104MEA5N
- Fabrikant:
- Nippon Chemi-Con
- Beskrivelse:
- CAP ALUM 100000UF 20% 63V SCREW
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 14341 Pieces
- Datablad:
- E32D630HPN104MEA5N.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for E32D630HPN104MEA5N, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til E32D630HPN104MEA5N via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 63V |
|---|---|
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | - |
| Størrelse / Dimension: | 3.000" Dia (76.20mm) |
| Serie: | U32D |
| Ripple Current: | 34.67A @ 120Hz |
| Polarisering: | Polar |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can - Screw Terminals |
| Driftstemperatur: | -40°C ~ 105°C |
| Monteringstype: | Chassis Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | E32D630HPN104MEA5N |
| Levetid @ Temp.: | 2000 Hrs @ 105°C |
| Blyafstand: | 1.250" (31.75mm) |
| Impedans: | - |
| Højde - Siddende (Max): | 4.125" (104.78mm) |
| Udvidet beskrivelse: | 100000µF 63V Aluminum Capacitors Radial, Can - Screw Terminals 7.7 mOhm @ 120Hz 2000 Hrs @ 105°C |
| ESR (Equivalent Series Resistance): | 7.7 mOhm @ 120Hz |
| Beskrivelse: | CAP ALUM 100000UF 20% 63V SCREW |
| kapacitans: | 100000µF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til E32D630HPN104MEA5N
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers