Købe ECH-U1H271GB5 med BYCHPS
Køb med garanti
ECH-U1H271GB5
- Varenummer:
- ECH-U1H271GB5
- Fabrikant:
- Panasonic
- Beskrivelse:
- CAP FILM 270PF 2% 50VDC 0805
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 14008 Pieces
- Datablad:
- ECH-U1H271GB5.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for ECH-U1H271GB5, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til ECH-U1H271GB5 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering - DC: | 50V |
|---|---|
| Spændingsbedømmelse - AC: | - |
| Tolerance: | ±2% |
| Afslutning: | Solder Pads |
| Størrelse / Dimension: | 0.079" L x 0.049" W (2.00mm x 1.25mm) |
| Serie: | ECH-U(B) |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | 0805 (2012 Metric) |
| Andre navne: | ECHU1H271GB5 PCF1094TR |
| Driftstemperatur: | -55°C ~ 125°C |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 8 Weeks |
| Producentens varenummer: | ECH-U1H271GB5 |
| Blyafstand: | - |
| Højde - Siddende (Max): | 0.039" (1.00mm) |
| Funktioner: | - |
| Udvidet beskrivelse: | 270pF ±2% Film Capacitor 50V Polyphenylene Sulfide (PPS), Metallized - Stacked 0805 (2012 Metric) |
| ESR (Equivalent Series Resistance): | - |
| Dielektrisk materiale: | Polyphenylene Sulfide (PPS), Metallized - Stacked |
| Beskrivelse: | CAP FILM 270PF 2% 50VDC 0805 |
| kapacitans: | 270pF |
| Applikationer: | General Purpose |
| Email: | [email protected] |
Relaterede dele til ECH-U1H271GB5
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers