Købe EDLF474B5R5C med BYCHPS
Køb med garanti
EDLF474B5R5C
- Varenummer:
- EDLF474B5R5C
- Fabrikant:
- Cornell Dubilier Electronics
- Beskrivelse:
- CAP 470MF 5.5V THROUGH HOLE
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 17157 Pieces
- Datablad:
- EDLF474B5R5C.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for EDLF474B5R5C, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til EDLF474B5R5C via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsvurdering: | 5.5V |
|---|---|
| Tolerance: | - |
| Afslutning: | Through Hole |
| Størrelse / Dimension: | 0.846" Dia (21.50mm) |
| Serie: | F |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Driftstemperatur: | -25°C ~ 85°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 14 Weeks |
| Producentens varenummer: | EDLF474B5R5C |
| Levetid @ Temp.: | 1000 Hrs @ 85°C |
| Blyafstand: | 0.197" (5.00mm) |
| Højde - Siddende (Max): | 0.374" (9.50mm) |
| Udvidet beskrivelse: | 470mF (EDLC) Supercapacitor 5.5V Radial, Can 75 Ohm @ 1kHz 1000 Hrs @ 85°C |
| ESR (Equivalent Series Resistance): | 75 Ohm @ 1kHz |
| Beskrivelse: | CAP 470MF 5.5V THROUGH HOLE |
| kapacitans: | 470mF |
| Email: | [email protected] |
Relaterede dele til EDLF474B5R5C
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EEC-RG0V155VN | Panasonic Electronic Components | CAP 1.5F 3.6V T/H | Forespørgsel |
 |
PHB-5R0H255-R | Eaton | CAP 2.5F -10% +30% 5V T/H | Forespørgsel |
 |
MAL219691114E3 | Vishay BC Components | CAP 4F -20% +80% 5.6V T/H | Forespørgsel |
 |
EEC-F5R5H473 | Panasonic Electronic Components | CAP 47MF -20% +80% 5.5V T/H | Forespørgsel |
 |
EDLF473A5R5C | Cornell Dubilier Electronics (CDE) | CAP 47MF 5.5V THROUGH HOLE | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers