Købe EGPA250ELL562MM35S med BYCHPS
Køb med garanti
EGPA250ELL562MM35S
- Varenummer:
- EGPA250ELL562MM35S
- Fabrikant:
- Nippon Chemi-Con
- Beskrivelse:
- CAP ALUM 5600UF 20% 25V RADIAL
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 15060 Pieces
- Datablad:
- EGPA250ELL562MM35S.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for EGPA250ELL562MM35S, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til EGPA250ELL562MM35S via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spændingsbedømmelse: | 25V |
|---|---|
| Tolerance: | ±20% |
| Overflade Mount Land Størrelse: | - |
| Størrelse / Dimension: | 0.709" Dia (18.00mm) |
| Serie: | GPA |
| Ripple Current: | 3.264A @ 120Hz |
| Polarisering: | Polar |
| Emballage: | Bulk |
| Pakke / tilfælde: | Radial, Can |
| Andre navne: | 565-3384 EGPA250ELL562MM35S-ND |
| Driftstemperatur: | -40°C ~ 125°C |
| Monteringstype: | Through Hole |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Fabrikantens standard ledetid: | 15 Weeks |
| Producentens varenummer: | EGPA250ELL562MM35S |
| Levetid @ Temp.: | 5000 Hrs @ 125°C |
| Blyafstand: | 0.295" (7.50mm) |
| Impedans: | - |
| Højde - Siddende (Max): | 1.437" (36.50mm) |
| Udvidet beskrivelse: | 5600µF 25V Aluminum Capacitors Radial, Can 19 mOhm @ 100kHz 5000 Hrs @ 125°C |
| ESR (Equivalent Series Resistance): | 19 mOhm @ 100kHz |
| Beskrivelse: | CAP ALUM 5600UF 20% 25V RADIAL |
| kapacitans: | 5600µF |
| Applikationer: | Automotive |
| Email: | [email protected] |
Relaterede dele til EGPA250ELL562MM35S
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers