Købe EMX2DXV6T5 med BYCHPS
Køb med garanti
EMX2DXV6T5
- Varenummer:
- EMX2DXV6T5
- Fabrikant:
- AMI Semiconductor / ON Semiconductor
- Beskrivelse:
- TRANS 2NPN 50V 0.1A SOT563
- Blyfri Status / RoHS Status:
- Indeholder bly / RoHS ikke-kompatibel
- Tilgængelig mængde:
- 17569 Pieces
- Datablad:
- EMX2DXV6T5.pdf
Introduktion
BYCHIPS er strømforsyningsdistributøren for EMX2DXV6T5, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til EMX2DXV6T5 via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Samler Emitter Opdeling (Max): | 50V |
|---|---|
| Vce Mætning (Max) @ Ib, Ic: | 400mV @ 5mA, 50mA |
| Transistor Type: | 2 NPN (Dual) |
| Leverandør Device Package: | SOT-563 |
| Serie: | - |
| Strøm - Max: | 500mW |
| Emballage: | Tape & Reel (TR) |
| Pakke / tilfælde: | SOT-563, SOT-666 |
| Driftstemperatur: | -55°C ~ 150°C (TJ) |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 1 (Unlimited) |
| Producentens varenummer: | EMX2DXV6T5 |
| Frekvens - Overgang: | 180MHz |
| Udvidet beskrivelse: | Bipolar (BJT) Transistor Array 2 NPN (Dual) 50V 100mA 180MHz 500mW Surface Mount SOT-563 |
| Beskrivelse: | TRANS 2NPN 50V 0.1A SOT563 |
| DC Current Gain (hFE) (Min) @ Ic, Vce: | 120 @ 1mA, 6V |
| Nuværende - Collector Cutoff (Max): | 500nA (ICBO) |
| Nuværende - Samler (Ic) (Max): | 100mA |
| Email: | [email protected] |
Relaterede dele til EMX2DXV6T5
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EMX2DXV6T5G | ON Semiconductor | TRANS 2NPN 50V 0.1A SOT563 | Forespørgsel |
 |
2N2920A | Central Semiconductor Corp | TRANS 2NPN 30MA 60V TO78-6 | Forespørgsel |
 |
BC857BS,135 | Nexperia USA Inc. | TRANS 2PNP 45V 0.1A 6TSSOP | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI to reduce costs in Wireless business; OMAP™ processors and wireless connectivity solutions will focus on embedded markets
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers