Købe EP2AGX45CU17I3G med BYCHPS
Køb med garanti
EP2AGX45CU17I3G
- Varenummer:
- EP2AGX45CU17I3G
- Fabrikant:
- Altera (Intel)
- Beskrivelse:
- IC FPGA 156 I/O 358UBGA
- Blyfri Status / RoHS Status:
- Blyfri / RoHS-kompatibel
- Tilgængelig mængde:
- 19487 Pieces
Introduktion
BYCHIPS er strømforsyningsdistributøren for EP2AGX45CU17I3G, vi har lagrene til omgående forsendelse og også tilgængelig for lang tid levering. Send venligst din købsplan til EP2AGX45CU17I3G via e-mail, vil vi give dig den bedste pris i henhold til din plan.
specifikationer
| Spænding - Forsyning: | 0.87 V ~ 0.93 V |
|---|---|
| Samlet RAM-bit: | 3517440 |
| Leverandør Device Package: | 358-UBGA, FCBGA (17x17) |
| Serie: | Arria II GX |
| Pakke / tilfælde: | 358-LFBGA, FCBGA |
| Driftstemperatur: | -40°C ~ 100°C (TJ) |
| Antal logiske elementer / celler: | 42959 |
| Antal LAB'er / CLB'er: | 1805 |
| Antal I / O: | 156 |
| Monteringstype: | Surface Mount |
| Fugtfølsomhedsniveau (MSL): | 3 (168 Hours) |
| Fabrikantens standard ledetid: | 16 Weeks |
| Producentens varenummer: | EP2AGX45CU17I3G |
| Beskrivelse: | IC FPGA 156 I/O 358UBGA |
| Email: | [email protected] |
Relaterede dele til EP2AGX45CU17I3G
| Billede | Varenummer | producenter | Beskrivelse | Udsigt |
|---|---|---|---|---|
 |
EP2AGX45CU17C6 | Altera | IC FPGA 156 I/O 358UBGA | Forespørgsel |
|
EP2AGX45CU17I3N | Altera | IC FPGA 156 I/O 358UBGA | Forespørgsel |
|
EP2AGX45CU17C5N | Altera | IC FPGA 156 I/O 358UBGA | Forespørgsel |
|
EP2AGX45CU17I5 | Altera | IC FPGA 156 I/O 358UBGA | Forespørgsel |
|
EP2AGX45CU17C6G | Altera | IC FPGA 156 I/O 358UBGA | Forespørgsel |
|
EP2AGX45CU17I5N | Altera | IC FPGA 156 I/O 358UBGA | Forespørgsel |
|
EP2AGX45CU17C4 | Altera | IC FPGA 156 I/O 358UBGA | Forespørgsel |
|
EP2AGX45CU17C4N | Altera | IC FPGA 156 I/O 358UBGA | Forespørgsel |
|
EP2AGX45CU17C5 | Altera | IC FPGA 156 I/O 358UBGA | Forespørgsel |
|
EP2AGX45CU17C6N | Altera | IC FPGA 156 I/O 358UBGA | Forespørgsel |
Laast News
- Xilinx Ships Industry's First 16nm All Programmable MPSoC Ahead of Schedule
- Xilinx and Samsung Jointly Enable the World's First 5G NR Commercial Deployment
- TI's Peter Balyta to head Education Technology division; Melendy Lovett to retire
- Janet Clark to join TI board of directors
- TI unveils DLP® 0.66-inch 4K ultra-high definition (UHD) chip, enabling more affordable large screen projection displays for home, business and education
- GCHQ Director calls for international cyber pact
- Embedded World: Arm introduces fourth security element to PSA
- Last chance: Nominate BrightSparks before 28 February
- Embedded World 2019: Get the full Electronics Weekly Guide
- "Xcell Journal" Special Edition: Xilinx Customers Shape a Brilliant Future
- Xilinx Launches Public Access of the SDSoC Development Environment to Expand Zynq SoC User Base to Broad Community of Systems and Software Engineers
- Texas Instruments names Haviv Ilan senior vice president of High Performance Analog